Yes Engineering YES-3TA HMDS Vapor Prime Oven

Vacuum Bake/Vapor Prime processing provides improved line uniformity after etch due to the uniformity of the resist adhesion. Vapor Priming allows the application of HMDS (hexamethyldisilzane) in a monolayer. Contamination issues are reduced by exposing the wafers to HMDS vapor rather than liquid. The reduction of liquid required for a vapor deposition vs. the liquid application of spin priming reduces costs. ……………………………………………………………………………………………………………………………………………………………………………………………………………………………..

Key Features

  • Operation temperature ambient to 160° C
  • Handles wafers up to 4”
  • Programmable process time and temperature

 

Key Applications and available processes

  • Vapor prime
  • Vacuum bake

General Documentation

YES-3TA system SOP (standard operation procedure)

Contact

Jun Chen or Michael McDonald

 

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Equipment Fee

Fabrication Service Tier 1