Wire Bonder – West Bond 4KE

The West Bond 4KE wire bonder is a tool to bond/connect conducting wires from electronic devices to chip carrier/PCB boards. This West Bond 4KEH Series features Semi-Automatic, Motorized Y/Z Axes, and 90° deep access Wedge-Wedge bonding. Currently, this machine only provides deep access wedge bond for 1mil gold wires.

Key Features

• Low Frequency (63kHz) Wedge-Wedge and Ball-Wedge Bonding Machine.
• Standard adjustable height working platform.
• Deep access 90° wedge bond with 1 mil gold wire.
• Semi-automatic bonding.
• Heat adjustable Working stage.

Key Applications

• Nanoelectronics devices wire bonding
• Bioelectronics devices wire bonding

General Documentation

(not available yet)

Contact

Jun Chen or Matt France

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Equipment Fee

Fabrication Service 2