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Wire Bonder – West Bond 4KE
The West Bond 4KE wire bonder is a tool to bond/connect conducting wires from electronic devices to chip carrier/PCB boards. This West Bond 4KEH Series features Semi-Automatic, Motorized Y/Z Axes, and 90° deep access Wedge-Wedge bonding. Currently, this machine only provides deep access wedge bond for 1mil gold wires.
Key Features
- Low Frequency (63kHz) Wedge-Wedge and Ball-Wedge Bonding Machine.
- Standard adjustable height working platform.
- Deep access 90° wedge bond with 1 mil gold wire.
- Semi-automatic bonding.
- Heat adjustable Working stage.
Key Applications
- Nanoelectronics devices wire bonding
- Bioelectronics devices wire bonding
General Documentation
(not available yet)
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Equipment Fee
Fabrication Service 2