Suss MJB3 Contact Mask Aligner

The Karl Suss MJB3 Contact Aligner system can perform precision mask-to-wafer (sample) 1:1 contact printing in hard contact mode. It can accommodate exposure of irregularly shaped substrates and standard wafers up to 3”. 

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Key Features

  • Contact 1:1 aligner
  • IR capability (back side alignment)   
  • Approximate exposure intensity: 14.5 mW/cm2 at 365 nm, 25 mW/cm2 at 405 nm
  • Substrate size up to 3”
  • Mask size 4”
  • Line/space resolution 2.5 microns
  • Aligner performs in hard contact/soft contact and vacuum mode

Key Applications and available processes

  • Patterning
  • MEMS
  • Semiconductor devices

 

General Documentation

Suss MJB3 Mask Aligner SOP (standard operation procedure)


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Equipment Fee
Fabrication Service 1