Suss MJB3 Contact Mask Aligner
The Karl Suss MJB3 Contact Aligner system can perform precision mask-to-wafer (sample) 1:1 contact printing in hard contact mode. It can accommodate exposure of irregularly shaped substrates and standard wafers up to 3”.
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Key Features
- Contact 1:1 aligner
- IR capability (back side alignment)
- Approximate exposure intensity: 14.5 mW/cm2 at 365 nm, 25 mW/cm2 at 405 nm
- Substrate size up to 3”
- Mask size 4”
- Line/space resolution 2.5 microns
- Aligner performs in hard contact/soft contact and vacuum mode
Key Applications and available processes
- Patterning
- MEMS
- Semiconductor devices
General Documentation
Suss MJB3 Mask Aligner SOP (standard operation procedure)
Contact
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Equipment Fee
Fabrication Service 1
