Reactive Ion Etching System (RIE)

RIE

Reactive Ion Etching System (RIE)

Trion Technology Phantom III LT

The Phantom III RIE system is designed to supply research laboratories with state-of-the-art-plasma etch capability for single wafers and small samples. Our RIE system has four process gases for etching a variety of materials.  It can also be used for stripping photoresists and other organic materials.  The system is controlled by a user-friendly touch screen computer system.  Recipes may be stored on the computer for repeated runs under the same conditions.

Specifications:
Max RF power:  300 W
Max wafer size:  8”
Gases available:  CF4, O2, SF6, CHF3