APEX ICP-RIE Etcher Fluorine

APEX ICP-RIE etcher Fluorine

The Plasma-Therm APEX ICP (Inductively Coupled Plasma) RIE Fluorine Etch is an etching system which uses Fluorine based chemistries to etch Si, SiO2, SiN and other materials.

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Key Features

· Gases available: CF4, CHF3, SF6, CH4, H2, O2, Ar, N2, He

· ICP generator: 2000 W at 2 MHz

· RF generator: 600 W at 13.56 MHz

· Laser endpoint

· Mechanical clamp w/ He backside cooling

· Platen temperature -40C to 250C

· Sample size: small pieces up to 4″ wafers

· Load locked

· Materials etched: Si, SiO2, SiN, SiC, Ti, W, low-k dielectrics

 

Key Applications and available processes

· MEMS

· Si, SiO2, SiN, SiC

 

General Documentation

APEX ICP-RIE etcher (Fluorine) system SOP (standard operation procedure)

 

Contact

Matt France or Esta Abelev

 

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Equipment Fee

Fabrication CR Service 3