APEX ICP-RIE Etcher Chlorine

APEX ICP-RIE etcher Chlorine

The Plasma-Therm APEX ICP (Inductively Coupled Plasma) RIE Chlorine Etch is an etching system which uses chlorine based chemistries to etch metal films and compound semiconductors.

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Key Features

· Gases available: Cl2, BCl3, HBr, SF6, CH4, H2, O2, Ar, N2, He

· ICP generator: 2000 W at 2 MHz

· RF generator: 600 W at 13.56 MHz

Photo of the APEX ICP-RIE Chlorine System

· Mechanical clamp w/ He backside cooling

· Platen temperature -40C to 250C

· Sample size: small pieces up to 4″ wafers

· Load locked

· Materials etched: metals, II-V

 

Key Applications and available processes

· MEMS

· Metals etching

· compound semiconductor

General Documentation

APEX ICP-RIE etcher (Chlorine) system SOP (standard operation procedure)

Contact

Matt France or Esta Abelev

 

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Equipment Fee

Fabrication CR Service 3