APEX ICP-RIE Etcher Chlorine
APEX ICP-RIE etcher Chlorine
The Plasma-Therm APEX ICP (Inductively Coupled Plasma) RIE Chlorine Etch is an etching system which uses chlorine based chemistries to etch metal films and compound semiconductors.
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Key Features
· Gases available: Cl2, BCl3, HBr, SF6, CH4, H2, O2, Ar, N2, He
· ICP generator: 2000 W at 2 MHz
· RF generator: 600 W at 13.56 MHz
· Mechanical clamp w/ He backside cooling
· Platen temperature -40C to 250C
· Sample size: small pieces up to 4″ wafers
· Load locked
· Materials etched: metals, II-V
Key Applications and available processes
· MEMS
· Metals etching
· compound semiconductor
General Documentation
APEX ICP-RIE etcher (Chlorine) system SOP (standard operation procedure)
Contact
Esta Abelev, Jun Chen, or Matt France
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Equipment Fee
Fabrication CR Service 3
