Disco DAD321 Dicing Saw

The Disco DAD321 Dicing Saw is capable of handling wafers up to six inches.  Ultron Systems UH114 Wafer/Frame Film Applicator w/ UV Tape & UH102 UV Curing system are available in support of DAD321. 

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Key Features

• Handles Silicon, Sapphire & glass samples
• Accepts blades for all substrates
• Up to 40,000 rpm blade speed
• LCD touch panel controls
• Auto-alignment
• Auto-focus
• Auto-kerf check

Key Applications and available processesw

• Used for dicing substrates into individual devices

General Documentation

Dicer system SOP (standard operation procedure)

Contact

Jun Chen or Dan Lamont

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Equipment Fee

Fabrication Service 2