ADT 7122 Wafer Dicer

The Advanced Dicing Technology (ADT) 7122 is an automatic wafer dicer with 6" diameter dicing area. It is an advanced, fully programmable saw for dicing thin materials into smaller pieces with 1-micron accuracy. Typical applications are Si wafer dicing, sapphire, glass, thin film devices, etc. can be cut with the proper choice of blade type.

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Key Features

• 2" air bearing spindle up to 1.8 kW
•    Turn table with high torque and high accuracy (1 micron).
•    High resolution camera (2000 x 2000 pixels) with X100 microscope.
•   Fully programmable with pre-loaded dicing recipes.
•   Blade diameter: 2"
•   Auto height, optical height sensor.
•   CO₂ in-line injector system to reduce DI water resistivity under 1 Megaohm/cm

Key Applications and available processes

• Used for dicing substrates into individual devices

General Documentation

Dicer system SOP (standard operation procedure) documents in development

Contact

Dan Lamont or Jun Chen

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Equipment Fee

Fabrication Service 2