Disco DAD321 Dicing Saw

The Disco DAD321 Dicing Saw is capable of handling wafers up to six inches.  Ultron Systems UH114 Wafer/Frame Film Applicator w/ UV Tape & UH102 UV Curing system are available in support of DAD321. 

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Key Features

  • Handles Silicon, Sapphire & glass samples
  • Accepts blades for all substrates
  • Up to 40,000 rpm blade speed
  • LCD touch panel controls
  • Auto-alignment
  • Auto-focus
  • Auto-kerf check

Key Applications and available processesw

  • Used for dicing substrates into individual devices

 

General Documentation

Dicer system SOP (standard operation procedure)

Photo of the Dicer

Contact

Dr. Jun Chen or Mike McDonald

 

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Equipment Fee

Fabrication Service 2