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Disco DAD321 Dicing Saw
The Disco DAD321 Dicing Saw is capable of handling wafers up to six inches. Ultron Systems UH114 Wafer/Frame Film Applicator w/ UV Tape & UH102 UV Curing system are available in support of DAD321.
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Key Features
- Handles Silicon, Sapphire & glass samples
- Accepts blades for all substrates
- Up to 40,000 rpm blade speed
- LCD touch panel controls
- Auto-alignment
- Auto-focus
- Auto-kerf check
Key Applications and available processesw
- Used for dicing substrates into individual devices
General Documentation
Dicer system SOP (standard operation procedure)
Contact
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Equipment Fee
Fabrication Service 2