Angstrom Engineering Sputtering System

Angstrom Engineering Sputtering System 

The Angstrom Engineering sputtering system a physical vapor deposition tool designed for rapid deposition. The system is equipped with four magnetron sputtering guns which use accelerated, positively charged ions from a plasma source to deposit films.

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Key Features

• 4 Onix 3” Sputter Sources – one sputter source capable of depositing magnetic materials
• Base pressure <2x10^-7 Torr (approximately 20 mins to 5×10^-6 Torr)
• Substrates up to 4”
• DC, pulsed DC (1000W) and RF (600W) generators

• Switch for Sputter Power Supply - Allows 1 power supply to be shared between 2 sources
• Advanced Downstream Gas Pressure Control – Reactive sputtering (O₂, N₂, Ar)
• RF Stage Bias - 100W

• Deposition Rate Sensor and PC Based Deposition Rate and Film Thickness Control
• Substrate heating(to 850C) and biasing

Key Applications and available processes

• Metal, oxide, and nitride thin film coatings
• Currently available targets: Fe, Al, Ti, W, Ag, Mo, Al₂O₃, WO₃, SiO₂, Si, Ge₂Sb₂Te₅, GeTe, Sb₂Te₃

General Documentation

Angstrom Sputtering system SOP (standard operation procedure)