Training Information
Training is required before new users can use any of the NFCF instruments. Training is done by staff or qualified volunteers and is arranged to fit their schedules. Training is performed on a first come first serve basis and is dependent on the status of the machine. There may be a waiting list. Training times vary depending on the level of difficulty for each instrument and additional training may be required by the staff before a user is authorized for full use of the instrument.
The following chart provides detail for planning purposes only. Length of sessions, number of sessions, and expected personnel for training are provided for review.
If you have not yet registered as a user with our lab click here to get started. Registration by completing our become a user section is a prerequisite to the equipment training options shown below.
Please click the following link for full detail of training request instructions.
You may also wish to review the group training options we have.
Please note that the training times listed are for basic operation of equipment. If access to specific attachments or special features are also being requested, additional training time may be required to gain access to the requested attachments or features.
Training Information for NFCF | ||||||
Equipment/Instrument | Training Time | Staff | ||||
Primary | Secondary | Training Price per hour(combined staff + equip) | ||||
Characterization Facility | Pitt | Non Profit | For Profit | |||
AFM - Veeco MultiModeV and Bruker Icon IV | 1 session / 3hr each | Dan Lamont | Susheng Tan | 80 | 130 | 220 |
Cressington Carbon Coater | 1 sessions / 1hr each | Dan Lamont | Matt France | 80 | 130 | 220 |
DSC 250- Differential Scanning Calorimeter | 1 session / 2hr each | Dan Lamont | 80 | 130 | 220 | |
Ellipsometer | 1 session / 2hr each | Dan Lamont | Susheng Tan | 80 | 130 | 220 |
EPMA- Electron Microprobe | 6 sessions / 3hr each | Susheng Tan | 100 | 180 | 280 | |
FIB-SEM_FEI Scios Dual Beam | 3 sessions / 4hr each | Dan Lamont | Susheng Tan | 115 | 195 | 290 |
FT-IR Microscope | 1 session / 2hr each | Dan Lamont | Susheng Tan | 80 | 130 | 220 |
Parylene Deposition Coater PDS 2010 | 1 session / 2-3hr each | Esta Abelev | Matt France | 93 | 155 | 255 |
PLD Deposition System | 1 session / 2-3hr each | Matt France | Dan Lamont | 93 | 155 | 255 |
Pd Sputter Coater | 80 | 130 | 220 | |||
PDMS Preparation Area | 1 session / 1hr each | Dan Lamont | Jun Chen | 80 | 130 | 220 |
Plasma Cleaner P.I.E. | 2 sessions / 0.5hr each | Susheng Tan | Dan Lamont | 80 | 130 | 220 |
Raman microscope | 1 session / 2hr each | Dan Lamont | Susheng Tan | 80 | 130 | 220 |
SEM- ZEISS Sigma500 VP | 1 session / 3hr each | Esta Abelev | Dan Lamont | 100 | 180 | 280 |
SEM - FEI Apreo | 1 session / 3hr each | Esta Abelev | Dan Lamont | 100 | 180 | 280 |
Sputter Coater Denton | 1 session / 0.5hr each | Esta Abelev | Dan Lamont | 80 | 130 | 220 |
STA 6000 Simultaneous Thermal Anayser (TGA/DSC) | Dan Lamont | 80 | 130 | 220 | ||
TEM- Hitachi 9500 ETEM | 3 sessions / 3hr each | Susheng Tan | Matt France | 115 | 195 | 290 |
TEM- JEOL JEM2100F | 4 sessions / 3hr each | Susheng Tan | Dan Lamont | 115 | 195 | 290 |
TEM- Thermo Scientific Titan Themic G2 200 STEM | 4 sessions / 3 hr each | Susheng Tan | Matt France | 142 | 225 | 350 |
TGA - Thermogravimetric analysis | 1 sessions / 2hr each | Dan Lamont | 80 | 130 | 220 | |
UV-Vis Optical Microscope | 1 session / 1hr each | Dan Lamont | 80 | 130 | 220 | |
Wire Bonder West Bond 4KE | Jun Chen | |||||
XRD- Bruker D8 XRD System | 1 session / 3hr each | Dan Lamont | Susheng Tan | 90 | 140 | 230 |
XRD PANanalytical Empyrean | 1 sesion / 3hr each | Dan Lamont | Susheng Tan | 90 | 140 | 230 |
Fischione 1040 NanoMill | 1 sessions / 2hr each | Dan Lamont | Matt France | 80 | 130 | 220 |
Fischione 1050 TEM Mill | 1 sessions / 1hr each | Dan Lamont | Matt France | 80 | 130 | 220 |
Fischione 1060 Ion Mill | 1 sessions / 1hr each | Dan Lamont | Matt France | 80 | 130 | 220 |
Fischione 1070 NanoClean Plasma Cleaner | 1 sessions / 1hr each | Dan Lamont | Matt France | 80 | 130 | 220 |
Fischione 110 Twin Jet Electropolisher | 1 sessions / 1hr each | Dan Lamont | Matt France | 80 | 130 | 220 |
Fischione 170 Ultrasonic Disk Cutter | 1 sessions / 1hr each | Dan Lamont | Matt France | 80 | 130 | 220 |
Fischione Model 200 Dimpling Grinder | 1 sessions / 1hr each | Dan Lamont | Matt France | 80 | 130 | 220 |
A1 Optical Micrsocope Zeiss Axio (1-2) | 1 sessions / 1hr each | Dan Lamont | Matt France | 80 | 130 | 220 |
Fabrication (Cleanroom) Facility | ||||||
Deposition System e-Beam Plassys | 1 session / 2hr each | Matt France | Esta Abelev | 93 | 155 | 255 |
Deposition System Sputter Angstrom | 1 session / 2-3hr each | Matt France | Esta Abelev | 93 | 155 | 255 |
Deposition System Thermal Evaporation Angstrom | Matt France | Esta Abelev | 77 | 125 | 210 | |
Dicing Saw | Reference FOM | Jun Chen | Dan Lamont | 93 | 170 | 270 |
e-Beam Evaporator Thermionics | 2 sessions / 2hr each | Matt France | 77 | 125 | 210 | |
EBL-e-Beam Lithography RAITH | 4 sessions / 4hr each | Jun Chen | Matt France | 93 | 170 | 270 |
E-Beam Lithography EBPG5150, 100kV | Jun Chen | 100 | 180 | 280 | ||
E-Beam Lithography Beamer, data prep | Jun Chen | tbd | ||||
HMDS Oven; YES-3DR | 1 session / 1hr each | Jun Chen | Dan Lamont | 77 | 125 | 210 |
Hood; Acid | 1 session / 1hr each | Jun Chen | E.Abelev/D.Lamont | 77 | 125 | 210 |
Hood; Litho 1 w/ Spinner | 1 session / 1hr each | Jun Chen | E.Abelev/D.Lamont | 77 | 125 | 210 |
Hood; Litho 2 w/ Spinner | 1 session / 1hr each | Jun Chen | E.Abelev/D.Lamont | 77 | 125 | 210 |
Hood; Litho 3 Developing | 1 session / 1hr each | Jun Chen | E.Abelev/D.Lamont | 77 | 125 | 210 |
Mask Aligner, Quintel | 1 session / 1hr each | Jun Chen | 77 | 125 | 210 | |
Maskless aligner, MLA100 | 1 session / 2-3hr each | Jun Chen | Matt France | 93 | 170 | 270 |
Oxidation Tube Furnace | 1 session / 2 hour each | Esta Abelev | E.Abelev/J.Chen | 77 | 125 | 210 |
Nanoscribe Photonic Professional | 1 session / 2-3hr each | Jun Chen | Esta Abelev | 93 | 170 | 270 |
Optical Microscope, cleanroom | 1 session / 1hr each | Jun Chen | E.Abelev/D.Lamont | 77 | 125 | 210 |
PECVD (Plasma Enhanced Chemical Vapor Deposition) | 1 session / 1hr each | Matt France | Esta Abelev | 77 | 125 | 210 |
Plasma Asher- March PX500 | 1 session / 1hr each | Jun Chen | Matt France | 77 | 125 | 210 |
RIE- Reactive Ion Etcher (Trion) | 1 session / 1hr each | Jun Chen | Esta Abelev | 77 | 125 | 210 |
ICP-RIE PlasmaTherm Chlorine | 1 session / 2 hr each | Esta Abelev | M.France/J.Chen | 93 | 155 | 255 |
ICP-RIE PlasmaTherm Fluorine | 1 session / 1 hr each | Esta Abelev | M.France/J.Chen | 93 | 155 | 255 |
RTA- Solaris | 1 session / 1hr each | Matt France | Esta Abelev | 77 | 125 | 210 |
Surface Profiler Dektek XT | 1 session / 1hr each | Jun Chen | E.Abelev/D.Lamont | 77 | 125 | 210 |
Thin Film Analyzer Filmetrics F40 | Dan Lamont | E.Abelev/J.Chen | 77 | 125 | 210 | |
Ultratech Fiji ALD | 1 session / 2hr each | Matt France | Esta Abelev | 93 | 155 | 255 |
You may also wish to review the following related sections:
Equipment Pricing listing, please note that staff hours and equipment hourly cost are charged during training.
Equipment capabilities listings
Lab Policies (policies section currently being updated)
ICP-RIE PlasmaTherm Chlorine |