Reactive Ion Etching System (RIE)

The Trion Phantom III LT RIE (Reactive Ion Etching) is an etching system which uses fluoride solutions to etch metal films and compound semiconductors.

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Key Features

  • 300 Watts (13.56 MHz) solid state RF generator.
  • Substrates up to 8” wafers.
  • Mass Flow Controller (MFW) for control of gas flow.
  • Gases available: CF4, O2, SF6, CHF3 

Key Applications and available processes

  • Semiconductor fabrication
  • R & D production and application
  • Silicon Etching
  • Polymers etching
  • Glass etching
  •  MEMS

 

General Documentation

RIE system SOP (standard operation procedure)

Photo of the RIEContact

Matt France or Mike McDonald

 

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Equipment Fee

Fabrication Service 1