Parylene Deposition Coater – PDS 2010

The Parylene Deposition Coater PDS 2010 applies conformal Parylene coatings to components such as circuit boards, sensors, wafers, medical devices, MEMS and elastomeric components for research, development, and repairs.  Ultrathin parylene coatings are inert and biocompatible and have excellent moisture, chemical, and dielectric barrier properties.

Parylene polymer coatings are applied via vapor deposition equipment, which allows for the precise control of coating rate and thickness. The deposition process begins as the powdered precursor (dimer) is vaporized under vacuum and heated to form a dimeric gas. The gas is then pyrolized to cleave the dimer into its monomeric form, and finally is deposited as a transparent polymer film.

Because Parylene is applied as a gas, the coating effortlessly penetrates crevices and tight areas on multi-layer components, providing complete and uniform encapsulation. Optimal thickness of the polymer coatings is determined based on the application and the coating properties desired. While Parylene coatings can range in thickness from hundreds of angstroms to several mils, a typical thickness is in the microns range.

Photo of the PLD 2010


Key Applications

  • Printed circuit boards
  • Medical components
  • Electronic sensors
  • Other small substrates


General Documentation

TBD Parylene Deposition Coater PDS-2010 SOP (standard operation procedure)



Esta Abelev or Matt France


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Equipment Fee

Fabrication CR Service 1



Room 620 Benedum hall